PUBLICATION
Advanced Display and Nano Convergence Laboratory
Conference
Conference
2014 Metal-containing thin film encapsulation with flexibility and high heat transfer
본문
- Author
- Jeong Hyun Kwon, Eungtaek Kim, Sang-Hee Ko Park and Kyung Cheol Choi
- Journal
- IMID 2014
- Year
- 2014
- Status
- August, Published