2016 Heat transferable thin film encapsulation inserted Ag thin film for improving reliability of flexible displays 본문 Author Jeong Hyun Kwon Journal SID 2016 Year 2016 Status May, Published 목록 이전글A Transparent, Flexible, Patternable Electrode Using a Multilayer Film Structure 25.06.21 다음글Surface plasmon interference lithography using Al grating structure on glass 25.06.21