PUBLICATION
Advanced Display and Nano Convergence Laboratory
Conference
Conference
2018 Stress‐minimized and Robust Thin Film Encapsulation based on Mechanically Improved Nanolaminate and Organic Layers
본문
- Author
- Jeong Hyun Kwon, Yongmin Jeon, and Kyung Cheol Choi
- Journal
- SID 2018
- Year
- 2018
- Status
- May, Published